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MA – Investigation of surface roughness on the properties of wire bonds

Investigation of surface roughness on the properties of wire bonds

Metal Ceramic Substrates (e.g. DCB substrates) are widely used in power electronics. Bonding thin wires (e.g. 50/75 µm AlSi wires) on DCB Cu surfaces is one of the challenges regarding next generation power modules.

The aim of this thesis is to investigate the influence of DCB surface roughness and micro-positioning of bonding wires (e.g. with respect to grain boundaries) on the wire bond performance. Based on a well thought test plan, the impact of material properties on the wire bond joints shall be studied by means of microstruc-tural and mechanical analytics. The work is advantageously accompanied by a literature study. All theoretical and experimental results must be comprehensively documented and discussed.

Betreuer: Christoph Bayer (Fraunhofer IISB) – Telefon: 09131-761215; Email: Christoph.Bayer@iisb.fraunhofer.de

Für Studienfächer: EEI, Mechatronik, Energietechnik, Nanotechnologie

Frühest möglicher Beginn: Sofort

Verantwortlicher: Prof. Dr.-Ing. Martin März